Chip Assembly/Testing

Chip Assembly/Testing

Design service Lab provide test chip engineer testing service based on wafer and package sort. The test chips include SOC, NVM memory/Library IP, high speed interface IP, Mixed signal and RF IP. The lab can also support DIP,COB, QFP quick package.

01

IP Testing

02

SoC Testing

03

Bonding Service

04

RF wafer level testing

For more information, please contact your account manager or login to SMIC NOW

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